Allegro MicroSystems has announced the launch of two new current sensor ICs - the ACS37030MY and the ACS37220MZ.

Altera, a developer of FPGA innovations, has launched the Altera Solution Acceleration Partner (ASAP) Program, an initiative ...

Hirose has expanded its FPC-to-board product offering to include a two-piece harsh environment connector that simplifies ...

Infineon Technologies breaks ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok.

A recent study by ZeroBounce has ranked major global and European technological hubs with London coming first.

Capable of delivering up to 5kV across 26 or 34 contacts in a compact Ø18 mm design, these connectors provide unmatched ...

EPC, a leading developer of enhancement-mode gallium nitride (eGaN) power devices, has introduced the EPC91200 design.

The IPMS has developed innovative OLED stacks that enable exceptionally bright microdisplays, suitable for AR glasses.

Plessey Semiconductors and Meta Platforms have developed what is claimed to be the world's brightest red microLED display suitable for augmented reality (AR) glasses. World's brightest red MicroLED ...

The company recently announced that it had achieved the integration of co-packaged optics (CPO) with advanced semiconductor packaging technologies, with sample deliveries expected to commence in early ...

congatec has announced that it is updating its conga-SA8 SMARC modules and the low-power Computer-on-Modules (COMs) are now available with the latest Intel Core 3 processor generation. Updated ...

Display solutions and embedded systems provider, Review Display Systems (RDS) has announced the availability of a range of new Memory-in-Pixel (MIP) display modules. Each individual pixel in a MIP ...