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Qualcomm's new chip packaging deal with UMC could upset TSMCThe chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a ...
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Should You Buy Taiwan Semiconductor Before January 16th?Taiwan Semiconductor Manufacturing (NYSE:TSM) is the straw that stirs the artificial intelligence drink. As the world's ...
UMC, founded in 1980, was Taiwan’s first semiconductor company. The company was the first to offer foundry services, and the first chip company on the Taiwan Stock Exchange (1985). UMC offers 28nm ...
It is optimized for low power ... Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process Data Block of DDR3/DDR4/LPDDR2/LPDDR3 ...
UMC secured a significant advanced packaging order from Qualcomm for high-performance computing (HPC) chips, reports the Economic Daily News. This move marks UMC’s expansion in the advanced packaging ...
While smartphone and PC markets show signs of AI-driven recovery, the global automotive sector's weak outlook for 2025 is ...
UMC 22uLP and 22uLL form a super set to support a voltage domain from 1.0V to 0.6V, allowing customers to enjoy the benefits of both technologies on system-on-chip (SoC) designs. The 22nm platform is ...
TSMC, which dominates the global high-end chip market, is building two advanced wafer fabs and planning another. According to Taipei-based market information advisory firm TrendForce Corp (集邦科技), UMC ...
That said, a new report claims that Qualcomm has reached an agreement with United Microelectronics Corporation (UMC) to implement its “advanced packaging” technology in its chips. Qualcomm may ...
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